Title :
Chip-to-Chip Optical Interconnection for Next-generation High-performance Systems
Author :
Oda, Mikio ; Sakai, Jun ; Takahashi, Hisaya ; Kouta, Hikaru
Author_Institution :
NEC Corp., Sagamihara
Abstract :
Novel key devices,"high-speed and high-density optical modules," are developed. The optical modules were 12-channel on 4.5 mmtimes4.5 mm ceramic substrates. They worked successfully at 10 Gbps with an error rate of less than 1.0times10-12.
Keywords :
ceramics; integrated circuit interconnections; optical interconnections; ceramic substrates; chip-to-chip optical interconnection; high-density optical modules; high-speed optical modules; next-generation high-performance systems; High speed optical techniques; Integrated circuit interconnections; Large scale integration; Optical coupling; Optical fiber testing; Optical interconnections; Optical receivers; Optical transmitters; Optical waveguides; Vertical cavity surface emitting lasers;
Conference_Titel :
Lasers and Electro-Optics Society, 2007. LEOS 2007. The 20th Annual Meeting of the IEEE
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-0925-9
Electronic_ISBN :
1092-8081
DOI :
10.1109/LEOS.2007.4382568
