• DocumentCode
    2104431
  • Title

    Coupled 3D opto-mechanically study of a free-space optical intra-chip interconnect module

  • Author

    Vervaeke, M. ; Debaes, C. ; Thienpont, H.

  • Author_Institution
    Vrije Univ. Brussel, Brussels
  • fYear
    2007
  • fDate
    21-25 Oct. 2007
  • Firstpage
    640
  • Lastpage
    641
  • Abstract
    In this work we present a tolerance aware design flow for passive micro-optical modules. Concretely, we apply the process to a free-space intra-chip interconnection module which has been prototyped with the deep proton writing technology.
  • Keywords
    micro-optics; modules; optical interconnections; 3D opto-mechanically study; deep proton writing technology; free-space optical intrachip interconnect module; passive microoptical module; tolerance aware design flow; Chemical technology; Lenses; Microoptics; Optical coupling; Optical design; Optical interconnections; Optical sensors; Protons; Prototypes; Writing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics Society, 2007. LEOS 2007. The 20th Annual Meeting of the IEEE
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    1092-8081
  • Print_ISBN
    978-1-4244-0925-9
  • Electronic_ISBN
    1092-8081
  • Type

    conf

  • DOI
    10.1109/LEOS.2007.4382569
  • Filename
    4382569
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2104431