Title :
Coupled 3D opto-mechanically study of a free-space optical intra-chip interconnect module
Author :
Vervaeke, M. ; Debaes, C. ; Thienpont, H.
Author_Institution :
Vrije Univ. Brussel, Brussels
Abstract :
In this work we present a tolerance aware design flow for passive micro-optical modules. Concretely, we apply the process to a free-space intra-chip interconnection module which has been prototyped with the deep proton writing technology.
Keywords :
micro-optics; modules; optical interconnections; 3D opto-mechanically study; deep proton writing technology; free-space optical intrachip interconnect module; passive microoptical module; tolerance aware design flow; Chemical technology; Lenses; Microoptics; Optical coupling; Optical design; Optical interconnections; Optical sensors; Protons; Prototypes; Writing;
Conference_Titel :
Lasers and Electro-Optics Society, 2007. LEOS 2007. The 20th Annual Meeting of the IEEE
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-0925-9
Electronic_ISBN :
1092-8081
DOI :
10.1109/LEOS.2007.4382569
