DocumentCode
2104608
Title
Characterization of ultrathin plasma nitrided gate dielectrics in pMOSFET for 0.18 μm technology and beyond
Author
Tan, S.S. ; Ang, C.H. ; Lek, C.M. ; Chen, T.P. ; Cho, B.J. ; See, Alex ; Chan, Lap
Author_Institution
Dept. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
fYear
2002
fDate
2002
Firstpage
254
Lastpage
258
Abstract
The impact of nitrogen plasma nitridation on the interfacial quality of ultrathin oxide (1.8 nm and 2.6 nm) and negative bias temperature instability (NBTI) have been investigated. It is found that the plasma-nitridation can more effectively suppress nitrogen-induced and boron-induced hole mobility degradation than that of thermal nitridation. Therefore, a higher amount of nitrogen can be incorporated into the plasma-nitrided oxide to suppress boron penetration without compromising the oxide interfacial quality. Furthermore, plasma-nitrided oxides have higher resistance to NBTI and longer NBTI-lifetime than that of thermal-nitrided oxides.
Keywords
CMOS integrated circuits; MOSFET; boron; dielectric thin films; hole mobility; interface states; nitridation; plasma materials processing; semiconductor-insulator boundaries; stability; 0.18 micron; 1.8 nm; 2.6 nm; B penetration suppression; B-induced hole mobility degradation; N; N plasma nitridation; N-induced hole mobility degradation; NBTI-lifetime; Si:B-SiON; interface trap generation suppression; interfacial quality; negative bias temperature instability; p-channel MOSFET; pMOSFET; plasma-nitrided oxide; ultrathin oxide; ultrathin plasma nitrided gate dielectrics; Boron; Dielectrics; MOSFET circuits; Negative bias temperature instability; Niobium compounds; Nitrogen; Plasma temperature; Thermal degradation; Thermal resistance; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2002. IPFA 2002. Proceedings of the 9th International Symposium on the
Print_ISBN
0-7803-7416-9
Type
conf
DOI
10.1109/IPFA.2002.1025674
Filename
1025674
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