DocumentCode :
2105387
Title :
Development and in vitro evaluation of an artificial spinal disc loading cell
Author :
Kyriacou, Panayiotis A.
Author_Institution :
Sch. of Eng. & Math. Sci., City Univ. London, London, UK
fYear :
2012
fDate :
Aug. 28 2012-Sept. 1 2012
Firstpage :
4887
Lastpage :
4890
Abstract :
One of the common diseases for chronic low back pain is Disc Degeneration Disease (DDD). In this disease, spinal intervertebral disc loses its ability to safely handle the mechanical stresses. The knowledge of the in-vivo loading on the spinal disk is of great importance in the understanding of low back pain. In this study a loading cell has been developed utilizing an artificial spinal disc which was loaded with strain gauges and piezoresistive sensors in an effort to investigate the behavior of the sensors during in vitro loading of the disc. The artificial disc with all sensors was loaded in a laboratory environment. The in vitro loading produced reliable and repeatable results and therefore suggesting that such approach might aid in the development of an artificial intelligent disc which will contribute in the better understanding of the in vivo loading of the human spine.
Keywords :
biomechanics; bone; diseases; intelligent sensors; medical signal processing; neurophysiology; orthopaedics; piezoresistive devices; prosthetics; stress-strain relations; artificial intelligent disc; artificial spinal disc loading cell development; chronic low back pain; disc degeneration disease; diseases; human spine; in vitro artificial spinal disc loading cell evaluation; laboratory environment; mechanical stresses; piezoresistive sensors; spinal intervertebral disc; strain gauges; Back; Diseases; In vitro; Loading; Pain; Sensors; Strain; Biomimetics; Equipment Failure Analysis; Intervertebral Disc; Manometry; Pressure; Prostheses and Implants; Prosthesis Design; Weight-Bearing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
Conference_Location :
San Diego, CA
ISSN :
1557-170X
Print_ISBN :
978-1-4244-4119-8
Electronic_ISBN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2012.6347089
Filename :
6347089
Link To Document :
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