DocumentCode
2106132
Title
Low-power and high-speed DRAM readout scheme
Author
Sharroush, Sherif M.
Author_Institution
Dept. of Electr. Eng., Port Said Univ., Port Said, Egypt
fYear
2013
fDate
8-11 Dec. 2013
Firstpage
791
Lastpage
794
Abstract
The conventional readout scheme of the one-transistor one-capacitor dynamic random-access memory (1T-1C DRAM) cells depends on precharging the bitline parasitic capacitance, CBL, to VDD/2. Then, depending upon the stored data, this capacitance will either be charged to VDD or discharged to 0 V for stored “1” and “0”, respectively. However, the bitline parasitic capacitance is relatively large (typically 250 fF for the 0.13 μm CMOS technology), thus consuming a relatively large dynamic-power consumption and causing a sluggish operation. In this paper, a novel readout scheme that doesn´t require the precharge of the bitline will be proposed. Instead, the proposed scheme depends on predischarging it. The proposed scheme is simulated for the 0.13 μm CMOS technology with VDD = 1.2 V and shows 50% and 75% reductions in the read cycle time in case of stored “1” and “0”, respectively. Assuming that stored “1” and “0” have the same probability of occurrence, about 60% of the dynamic-power consumption is saved.
Keywords
CMOS integrated circuits; DRAM chips; high-speed integrated circuits; low-power electronics; power consumption; readout electronics; CMOS; DRAM readout scheme; capacitance 250 fF; dynamic random-access memory; dynamic-power consumption; size 0.13 mum; voltage 1.2 V; CMOS integrated circuits; MOSFET; Parasitic capacitance; Random access memory; dynamic random-access memory; dynamic-power consumption; read access time; read-cycle time;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics, Circuits, and Systems (ICECS), 2013 IEEE 20th International Conference on
Conference_Location
Abu Dhabi
Type
conf
DOI
10.1109/ICECS.2013.6815533
Filename
6815533
Link To Document