Title :
Enabling technologies for disappearing electronics in smart textiles
Author :
Jung, S. ; Lauterbach, C. ; Strasser, M. ; Weber, W.
Author_Institution :
Lab. for Emerging Technol., Infineon Technol. AG, Munich, Germany
Abstract :
Enabling technologies for ´wearable electronics´, such as packaging and interconnect, are the key to the integration of electronics in textiles. A silicon-based micromachined thermoelectric generator chip for energy harvesting from body heat, and an interwoven antenna concept for textile radio frequency identification labels are presented.
Keywords :
identification technology; intelligent materials; packaging; wearable computers; enabling technologies; energy harvesting; interconnect; interwoven antenna concept; micromachined thermoelectric generator chip; packaging; radio frequency identification labels; smart textiles; wearable electronics; Electronic packaging thermal management; Fabrics; Humans; Microelectronics; Power generation; Silicon; Temperature; Textile technology; Thermoelectricity; Wires;
Conference_Titel :
Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC. 2003 IEEE International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-7707-9
DOI :
10.1109/ISSCC.2003.1234347
