Title :
From Layout To Circuit: Multi-dimensional Process And Device Simulation Current Status And Open Problems
Author_Institution :
Swiss Federal Institute of Technology
Keywords :
Analytical models; Circuit simulation; Computational modeling; Design optimization; III-V semiconductor materials; Integrated circuit technology; Laboratories; Ligaments; Microelectronics; Virtual prototyping;
Conference_Titel :
VLSI Process and Device Modeling, 1993. (1993 VPAD) 1993 International Workshop on
Print_ISBN :
0-7803-1338-0
DOI :
10.1109/VPAD.1993.724700
