• DocumentCode
    2107867
  • Title

    From Layout To Circuit: Multi-dimensional Process And Device Simulation Current Status And Open Problems

  • Author

    Fichtner, W.

  • Author_Institution
    Swiss Federal Institute of Technology
  • fYear
    1993
  • fDate
    14-15 May 1993
  • Firstpage
    2
  • Lastpage
    3
  • Keywords
    Analytical models; Circuit simulation; Computational modeling; Design optimization; III-V semiconductor materials; Integrated circuit technology; Laboratories; Ligaments; Microelectronics; Virtual prototyping;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Process and Device Modeling, 1993. (1993 VPAD) 1993 International Workshop on
  • Print_ISBN
    0-7803-1338-0
  • Type

    conf

  • DOI
    10.1109/VPAD.1993.724700
  • Filename
    724700
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2107867