Title :
Powder LSI: an ultra small RF identification chip for individual recognition applications
Author :
Usami, M. ; Sato, A. ; Sameshima, K. ; Watanabe, K. ; Yoshigi, H. ; Imura, R.
Author_Institution :
Hitachi, Tokyo, Japan
Abstract :
A powder-like 0.09 mm/sup 2/ 2.45 GHz RF identification chip for wireless recognition applications is described. This chip is fabricated in a 0.18 /spl mu/m CMOS process, and its thickness is 60 /spl mu/m. A two-surface connection technique is adopted to facilitate antenna attachment. The distance between the chip and a reader is 300 mm for a reader power of 300 mW.
Keywords :
CMOS analogue integrated circuits; UHF integrated circuits; identification technology; 0.18 /spl mu/m CMOS process; 0.18 micron; 2.45 GHz; 300 mW; 300 mm; 60 micron; antenna attachment; chip to reader distance; individual recognition applications; powder LSI; reader power; thickness; two-surface connection technique; ultra small RF identification chip; wireless recognition; CMOS process; Circuits; Clocks; Costs; Electrodes; Large scale integration; MOS capacitors; Powders; Radio frequency; Radiofrequency identification;
Conference_Titel :
Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC. 2003 IEEE International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-7707-9
DOI :
10.1109/ISSCC.2003.1234354
