• DocumentCode
    2107953
  • Title

    A System For 3 D Simulations Of Complex Si And Heterostructure Devices

  • Author

    Conti, Paolo ; Tomizawa, Masaaki ; Yoshii, Akira

  • Author_Institution
    NTT LSI Laboratories
  • fYear
    1993
  • fDate
    14-15 May 1993
  • Firstpage
    14
  • Lastpage
    15
  • Keywords
    Assembly; Capacitance; Computational modeling; Geometry; Large scale integration; MOSFET circuits; Mesh generation; Poisson equations; Solid modeling; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Process and Device Modeling, 1993. (1993 VPAD) 1993 International Workshop on
  • Print_ISBN
    0-7803-1338-0
  • Type

    conf

  • DOI
    10.1109/VPAD.1993.724703
  • Filename
    724703
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2107953