• DocumentCode
    2107955
  • Title

    Epoxy systems for low temperature applications

  • Author

    Rajadhyaksha, Mangesh

  • Author_Institution
    Huntsman Advanced Materials, Switzerland
  • fYear
    2007
  • fDate
    22-24 Oct. 2007
  • Firstpage
    382
  • Lastpage
    386
  • Abstract
    Epoxy-based formulated products are finding increased utility in a wide variety of structural and electrical applications that are required to operate in low temperature environments. Cryogenic technology is accelerating the growth in these fields. This versatile thermosetting polymer offers many attractive features such as high mechanical strength, outstanding dielectric characteristics, excellent adhesive properties, very good chemical resistance and excellent thermal endurance. Such features make them materials of choice for high and medium voltage electrical apparatus that operate in below zero Celsius environments. At lower operating temperatures, many factors come into play affecting overall performance. Among these factors are: speed and effectiveness of cure, fracture toughness characteristics, and thermal expansion properties.
  • Keywords
    adhesives; cryogenic electronics; epoxy insulation; high-voltage techniques; low-temperature techniques; polymers; cryogenic technology; epoxy system; high voltage electrical apparatus; low temperature applications; medium voltage electrical apparatus; thermosetting polymer; Acceleration; Chemical technology; Cryogenics; Dielectric materials; Electric resistance; Mechanical factors; Medium voltage; Polymers; Temperature; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference and Electrical Manufacturing Expo, 2007
  • Conference_Location
    Nashville, TN
  • Print_ISBN
    978-1-4244-0446-9
  • Electronic_ISBN
    978-1-4244-0447-6
  • Type

    conf

  • DOI
    10.1109/EEIC.2007.4562647
  • Filename
    4562647