DocumentCode
2107955
Title
Epoxy systems for low temperature applications
Author
Rajadhyaksha, Mangesh
Author_Institution
Huntsman Advanced Materials, Switzerland
fYear
2007
fDate
22-24 Oct. 2007
Firstpage
382
Lastpage
386
Abstract
Epoxy-based formulated products are finding increased utility in a wide variety of structural and electrical applications that are required to operate in low temperature environments. Cryogenic technology is accelerating the growth in these fields. This versatile thermosetting polymer offers many attractive features such as high mechanical strength, outstanding dielectric characteristics, excellent adhesive properties, very good chemical resistance and excellent thermal endurance. Such features make them materials of choice for high and medium voltage electrical apparatus that operate in below zero Celsius environments. At lower operating temperatures, many factors come into play affecting overall performance. Among these factors are: speed and effectiveness of cure, fracture toughness characteristics, and thermal expansion properties.
Keywords
adhesives; cryogenic electronics; epoxy insulation; high-voltage techniques; low-temperature techniques; polymers; cryogenic technology; epoxy system; high voltage electrical apparatus; low temperature applications; medium voltage electrical apparatus; thermosetting polymer; Acceleration; Chemical technology; Cryogenics; Dielectric materials; Electric resistance; Mechanical factors; Medium voltage; Polymers; Temperature; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation Conference and Electrical Manufacturing Expo, 2007
Conference_Location
Nashville, TN
Print_ISBN
978-1-4244-0446-9
Electronic_ISBN
978-1-4244-0447-6
Type
conf
DOI
10.1109/EEIC.2007.4562647
Filename
4562647
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