DocumentCode :
2108834
Title :
Table of contents
fYear :
2013
fDate :
26-27 Sept. 2013
Firstpage :
1
Lastpage :
4
Abstract :
The following topics are dealt with: integrated circuit design; system design; CMOS technology; Moore technologies; reliability; memory technologies; optical devices; photonics; organic electronics; flexible electronics; interconnection technologies; and packaging technologies.
Keywords :
CMOS integrated circuits; circuit reliability; flexible electronics; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; integrated optics; random-access storage; CMOS technology; Moore technologies; flexible electronics; integrated circuit design; interconnection technologies; memory technologies; optical devices; organic electronics; packaging technologies; photonics; reliability; system design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Conference Dresden-Grenoble (ISCDG), 2013 International
Conference_Location :
Dresden
Print_ISBN :
978-1-4799-1250-6
Type :
conf
DOI :
10.1109/ISCDG.2013.6656287
Filename :
6656287
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2108834
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