DocumentCode :
2109052
Title :
Fully integrated LTE Doherty power amplifier
Author :
Jinshu Zhao ; Wolf, Robert ; Ellinger, F.
Author_Institution :
Circuit Design & Network Theor, Tech. Univ. Dresden, Dresden, Germany
fYear :
2013
fDate :
26-27 Sept. 2013
Firstpage :
1
Lastpage :
3
Abstract :
This paper demonstrates a fully integrated Doherty power amplifier for the LTE standard. The Doherty power amplifier is fully integrated adopting a 0.25 μm SiGe BiCMOS technology. The quarter wave transmission line is implemented by lumped element components to save chip area. By combining the phase compensation network with the input matching network of the peak amplifier, the required inductor number of the Doherty amplifier is reduced. Hence, the chip size is just 1.3 mm×1.8 mm. The fabricated power amplifier delivers an output power of 22.5 dBm with a power added efficiency (PAE) of 21%. For the complete 6 dB back-off region, the PAE is above 10%, and satisfies the EVM requirements for the QPSK and QAM16 modulation schemes for the 2.4 GHz LTE downlink with 20 MHz bandwidth. The measured results prove that the demonstrated Doherty amplifier is applicable for full integration with reduced chip size.
Keywords :
BiCMOS analogue integrated circuits; Ge-Si alloys; Long Term Evolution; UHF integrated circuits; UHF power amplifiers; semiconductor materials; BiCMOS technology; QAM16 modulation schemes; QPSK; SiGe; back-off region; bandwidth 20 MHz; efficiency 21 percent; frequency 2.4 GHz; fully integrated LTE Doherty power amplifier; inductor; input matching network; lumped element components; phase compensation network; quarter wave transmission line; size 0.25 mum; Frequency measurement; Impedance matching; Inductors; Power amplifiers; Power generation; Power measurement; Power transmission lines; Doherty power amplifier; Hetero-junction bipolar transistor (HBT); SiGeBiCMOS; fully integrated; long term evolution (LTE);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Conference Dresden-Grenoble (ISCDG), 2013 International
Conference_Location :
Dresden
Print_ISBN :
978-1-4799-1250-6
Type :
conf
DOI :
10.1109/ISCDG.2013.6656295
Filename :
6656295
Link To Document :
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