Title :
Model of mutual coupling between two bonding wires on glass substrate
Author :
Dinh, Thanh Vinh ; Pasquet, Daniel ; Descamps, Philippe ; Lesenechal, Dominique ; Pagazani, Julien ; Lissorgues, Gaelle ; Nicole, Pierre
Author_Institution :
LaMIPS, Colombelles, France
Abstract :
This paper presents a simple model of mutual coupling between 2 bonding wires. The model has been compared to 3D full wave electromagnetic simulation up to 20 GHz. A good accordance was obtained.
Keywords :
electromagnetic coupling; glass; lead bonding; substrates; 3D full wave electromagnetic simulation; bonding wires; glass substrate; mutual coupling; Bonding; Glass; Inductance; Mathematical model; Mutual coupling; Solid modeling; Wires; Bonding wire; Electromagnetic modeling; Mutual coupling;
Conference_Titel :
Semiconductor Conference Dresden-Grenoble (ISCDG), 2013 International
Conference_Location :
Dresden
Print_ISBN :
978-1-4799-1250-6
DOI :
10.1109/ISCDG.2013.6656302
