Title :
Silicon carbide electronic devices and integrated circuits for extreme environments
Author :
Cooper, James A., Jr.
Author_Institution :
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
Abstract :
Silicon carbide (SiC) is a wide bandgap semiconductor that is highly suited for operation in extreme environments, including high temperatures and high levels of radiation. Electronic-grade wafers of SiC first became commercially available in the early 1990´s, and since that time SiC electronic device technology has progressed rapidly. This work reviews the current status of electronic device technology in SiC and assess the prospects for applying this technology to operation in extreme environments.
Keywords :
carrier density; electron-hole recombination; high-temperature electronics; monolithic integrated circuits; semiconductor device models; silicon compounds; thermal stability; wide band gap semiconductors; SiC; electronic device technology; high level radiation; high temperature environment; integrated circuits; silicon carbide electronic devices; wide bandgap semiconductor; Atomic measurements; CMOS technology; Fabrication; Integrated circuit technology; Lattices; Leakage current; Photonic band gap; Semiconductor materials; Silicon carbide; Temperature;
Conference_Titel :
Aerospace Conference, 2004. Proceedings. 2004 IEEE
Conference_Location :
Big Sky, MT
Print_ISBN :
0-7803-8155-6
DOI :
10.1109/AERO.2004.1368045