Title :
Thermo-mechanical analysis of MEMS pressure sensor die-attach for high temperature applications
Author :
Meyyappan, Karumbu ; McCluskey, Patrick ; Chen, LiangYu
Author_Institution :
CALCE EPSC, Maryland Univ., College Park, MD, USA
Abstract :
The thermomechanical stress generated by the mismatch of the coefficients of thermal expansion (CTE) of the sensor base material (SiC) and the packaging has a significant impact on the reliability of the packaged sensor. In the current work, non-linear finite element analysis was performed to determine the peeling, shear stresses and the von Mises stresses, in the SiC pressure sensor and the die attach which is intended for high temperature operation. A parametric study has been conducted to study the effects of the substrate material and reference (stress-free) temperature.
Keywords :
chip scale packaging; finite element analysis; high-temperature electronics; microassembling; microsensors; pressure sensors; reliability; silicon compounds; thermal expansion; thermal management (packaging); thermal stresses; wide band gap semiconductors; AlN; MEMS pressure sensor; SiC; SiC pressure sensor; coefficients of thermal expansion; die attach; high temperature applications; nonlinear finite element analysis; packaged sensor; peeling; reference temperature; reliability; sensor base material; shear stresses; substrate material effect; thermomechanical analysis; thermomechanical stress; von Mises stresses; Finite element methods; Materials reliability; Micromechanical devices; Packaging; Silicon carbide; Temperature sensors; Thermal expansion; Thermal sensors; Thermal stresses; Thermomechanical processes;
Conference_Titel :
Aerospace Conference, 2004. Proceedings. 2004 IEEE
Conference_Location :
Big Sky, MT
Print_ISBN :
0-7803-8155-6
DOI :
10.1109/AERO.2004.1368049
