Title :
Finite element analysis for BEOL stress engineering to improve yield and reliability of sub-30 nm structures
Author :
Kaulfersch, Eberhard ; Bramer, B. ; Rzepka, S. ; Breuer, Dirk ; Clauss, Ellen ; Feustel, Frank
Author_Institution :
Micro Mater. Center, Fraunhofer ENAS, Chemnitz, Germany
Abstract :
Deformation of trenches due to residual stresses in TiN may result in Cu voids forming especially at shrinking feature sizes of trenches and vias and introducing low-k dielectrics between Cu interconnects. The influence of residual stress therefore has been investigated in a parametric study using Finite Element analyses (FEA) to discover the correlation between the TiN stresses and failure occurrence at various geometric representations. FEA has been shown to allow effective BEoL (Back end of line) stress engineering leading to improved yield and reliability of next generation interconnect systems in minimum development time.
Keywords :
copper; deformation; finite element analysis; interconnections; internal stresses; low-k dielectric thin films; reliability; titanium compounds; vias; voids (solid); BEOL stress engineering; Cu; FEA; TiN; back end of line stress engineering; failure occurrence; finite element analysis; low-k dielectrics; next generation interconnect systems; residual stresses; structure reliability; trench deformation; Compressive stress; Deformable models; Finite element analysis; Residual stresses; Strain; Tin; (FEA) Finite Element analyses; DoE; TiN hard mask; residual stress; wiggling;
Conference_Titel :
Semiconductor Conference Dresden-Grenoble (ISCDG), 2013 International
Conference_Location :
Dresden
Print_ISBN :
978-1-4799-1250-6
DOI :
10.1109/ISCDG.2013.6656314
