• DocumentCode
    2109868
  • Title

    High-Speed Low-Current Duobinary Signaling Over Active Terminated Chip-to-Chip Interconnect

  • Author

    Rao, P. Vijaya Sankara ; Mandal, Pradip ; Sachdev, Sunil

  • Author_Institution
    Dept of E & ECE, Indian Inst. of Technol., Kharagpur
  • fYear
    2009
  • fDate
    13-15 May 2009
  • Firstpage
    73
  • Lastpage
    78
  • Abstract
    In this work we propose high-speed low-current duobinary signaling scheme over an active terminated chip-to-chip interconnect. The active termination scheme eliminates the need of any dedicated passive terminator both at the transmitter and receiver, avoiding signal reflection. Elimination of the passive terminator helps to reduce the transmitted signal level without effecting signal detect-ability of the receiver and also removes the thermal noise of the terminator. To implement bandwidth efficient duobinary signaling, we present a current-mode high-speed precoder operating at 10-Gb/s. A low-current active terminated driver based on modified Cherry-Hooper topology is proposed. At the receive-end, we propose an active terminated current-mode receiver(Rx) with regulated gate cascode (RGC) based transimpedance amplifier(TIA). Folded active inductor peaking is used to enhance the bandwidth of this TIA. We also propose low-power broadband equalizer topology for channel equalization. The duobinary transmitter and receiver circuits are implemented in 1.8-V, 0.18-mum Digital CMOS technology with an fT of 27-GHz. The designed high speed duobinary Tx/Rx circuits work up-to 8-Gb/s speed while transmitting the data over FR4 PCB trace of length 29.5-inch and for the targeted bit-error-rate(BER) of 10-12. The power consumed in the transmitter and receiver circuits is 42.9-mW at 8-Gb/s.
  • Keywords
    amplifiers; current-mode circuits; integrated circuit interconnections; signal detection; thermal noise; active terminated chip-to-chip interconnect; current-mode receiver; folded active inductor peaking; high-speed low-current duobinary signaling; regulated gate cascode; signal detectability; thermal noise; transimpedance amplifier; Acoustic reflection; Bandwidth; CMOS technology; Circuit topology; Driver circuits; Integrated circuit interconnections; Noise level; Noise reduction; Signal detection; Transmitters; active termination; chip-to-chip interconnect; duobinary;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI, 2009. ISVLSI '09. IEEE Computer Society Annual Symposium on
  • Conference_Location
    Tampa, FL
  • Print_ISBN
    978-1-4244-4408-3
  • Electronic_ISBN
    978-0-7695-3684-2
  • Type

    conf

  • DOI
    10.1109/ISVLSI.2009.9
  • Filename
    5076386