DocumentCode :
2109886
Title :
The fundamentals of designing deployable structures with elastic memory composites
Author :
Lake, Mark S. ; Campbell, Douglas
Author_Institution :
Composite Technol. Dev. Inc., Lafayette, CO, USA
Volume :
4
fYear :
2004
fDate :
13-13 March 2004
Firstpage :
2745
Abstract :
Elastic memory composite (EMC) materials exhibit many favorable qualities for deployable structures and have piqued a broad interest within America´s deployable space structures industry. EMC materials are similar to traditional fiber-reinforced composites except for the use of a thermoset shape memory resin that enables much higher packaging strains than traditional composites without damage to the fibers or the resin. This unique capability is being exploited in the development of very efficient EMC structural components for deployable spacecraft systems. The present paper is intended primarily to help deployable system designers develop a better understanding of the special capabilities of EMC materials, and the unique considerations that must be applied when engineering structural components with these materials. Specifically, the paper discusses: 1) the impacts of incorporating EMC materials on deployable system design, 2) analyses for packaging strain, deployment time, and deployment energy; and 3) requirements and concepts for heating systems.
Keywords :
aerospace engineering; aerospace industry; fibre reinforced composites; intelligent materials; packaging; resins; thermostats; deployable space structure system; deployable spacecraft system design; deployment energy; deployment time; elastic memory composite materials; engineering structural components; fiber-reinforced composites; heating system design; packaging strains; thermoset shape memory resin; Aerospace engineering; Aerospace industry; Aircraft manufacture; Capacitive sensors; Composite materials; Design engineering; Electromagnetic compatibility; Packaging; Resins; Shape;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Aerospace Conference, 2004. Proceedings. 2004 IEEE
Conference_Location :
Big Sky, MT
ISSN :
1095-323X
Print_ISBN :
0-7803-8155-6
Type :
conf
DOI :
10.1109/AERO.2004.1368072
Filename :
1368072
Link To Document :
بازگشت