DocumentCode :
2109976
Title :
Oxygen related defects and the reliability of high-k dielectric films in FETs
Author :
Leitsmann, R. ; Planitz, Philipp ; Nadimi, E. ; Ottking, Rolf
Author_Institution :
AQcomputare GmbH, Chemnitz, Germany
fYear :
2013
fDate :
26-27 Sept. 2013
Firstpage :
1
Lastpage :
4
Abstract :
The interaction between oxygen vacancies and dopant atoms in HfO2 dielectric were studied using first principles total energy calculations. Beside La dopants also the influence of fluorine and nitrogen atoms has been studied. La dopants in the vicinity of a neutral oxygen vacancy (VO) are more stable compared to the La defects far from VO centers. Furthermore, La atoms lead to a shift of the defect states of oxygen vacancies towards the conduction band edge. A similar but more pronounced effect can be observed by fluorine and nitrogen atoms filling the VO centers. These elements may therefore contribute to the reduction of the gate leakage current and improvement of the device reliability.
Keywords :
field effect transistors; fluorine; hafnium compounds; high-k dielectric thin films; leakage currents; nitrogen; reliability; FET; HfO2; HfO2 dielectric; conduction band edge; dopant atom; fluorine atom; gate leakage current; high-k dielectric film; neutral oxygen vacancy; nitrogen atom; oxygen related defect; reliability; Dielectrics; Hafnium compounds; Leakage currents; Logic gates; Passivation; Reliability; Stress; HfO2; ab initio; high-k; leakage current; reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Conference Dresden-Grenoble (ISCDG), 2013 International
Conference_Location :
Dresden
Print_ISBN :
978-1-4799-1250-6
Type :
conf
DOI :
10.1109/ISCDG.2013.6656327
Filename :
6656327
Link To Document :
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