• DocumentCode
    2109976
  • Title

    Oxygen related defects and the reliability of high-k dielectric films in FETs

  • Author

    Leitsmann, R. ; Planitz, Philipp ; Nadimi, E. ; Ottking, Rolf

  • Author_Institution
    AQcomputare GmbH, Chemnitz, Germany
  • fYear
    2013
  • fDate
    26-27 Sept. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The interaction between oxygen vacancies and dopant atoms in HfO2 dielectric were studied using first principles total energy calculations. Beside La dopants also the influence of fluorine and nitrogen atoms has been studied. La dopants in the vicinity of a neutral oxygen vacancy (VO) are more stable compared to the La defects far from VO centers. Furthermore, La atoms lead to a shift of the defect states of oxygen vacancies towards the conduction band edge. A similar but more pronounced effect can be observed by fluorine and nitrogen atoms filling the VO centers. These elements may therefore contribute to the reduction of the gate leakage current and improvement of the device reliability.
  • Keywords
    field effect transistors; fluorine; hafnium compounds; high-k dielectric thin films; leakage currents; nitrogen; reliability; FET; HfO2; HfO2 dielectric; conduction band edge; dopant atom; fluorine atom; gate leakage current; high-k dielectric film; neutral oxygen vacancy; nitrogen atom; oxygen related defect; reliability; Dielectrics; Hafnium compounds; Leakage currents; Logic gates; Passivation; Reliability; Stress; HfO2; ab initio; high-k; leakage current; reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Conference Dresden-Grenoble (ISCDG), 2013 International
  • Conference_Location
    Dresden
  • Print_ISBN
    978-1-4799-1250-6
  • Type

    conf

  • DOI
    10.1109/ISCDG.2013.6656327
  • Filename
    6656327