DocumentCode
2109976
Title
Oxygen related defects and the reliability of high-k dielectric films in FETs
Author
Leitsmann, R. ; Planitz, Philipp ; Nadimi, E. ; Ottking, Rolf
Author_Institution
AQcomputare GmbH, Chemnitz, Germany
fYear
2013
fDate
26-27 Sept. 2013
Firstpage
1
Lastpage
4
Abstract
The interaction between oxygen vacancies and dopant atoms in HfO2 dielectric were studied using first principles total energy calculations. Beside La dopants also the influence of fluorine and nitrogen atoms has been studied. La dopants in the vicinity of a neutral oxygen vacancy (VO) are more stable compared to the La defects far from VO centers. Furthermore, La atoms lead to a shift of the defect states of oxygen vacancies towards the conduction band edge. A similar but more pronounced effect can be observed by fluorine and nitrogen atoms filling the VO centers. These elements may therefore contribute to the reduction of the gate leakage current and improvement of the device reliability.
Keywords
field effect transistors; fluorine; hafnium compounds; high-k dielectric thin films; leakage currents; nitrogen; reliability; FET; HfO2; HfO2 dielectric; conduction band edge; dopant atom; fluorine atom; gate leakage current; high-k dielectric film; neutral oxygen vacancy; nitrogen atom; oxygen related defect; reliability; Dielectrics; Hafnium compounds; Leakage currents; Logic gates; Passivation; Reliability; Stress; HfO2 ; ab initio; high-k; leakage current; reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference Dresden-Grenoble (ISCDG), 2013 International
Conference_Location
Dresden
Print_ISBN
978-1-4799-1250-6
Type
conf
DOI
10.1109/ISCDG.2013.6656327
Filename
6656327
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