• DocumentCode
    2110361
  • Title

    Inducing Thermal-Awareness in Multicore Systems Using Networks-on-Chip

  • Author

    Atienza, David ; Martinez, Emilio

  • Author_Institution
    DACYA - Complutense Univ. of Madrid, Madrid
  • fYear
    2009
  • fDate
    13-15 May 2009
  • Firstpage
    187
  • Lastpage
    192
  • Abstract
    Technology scaling imposes an ever increasing temperature stress on digital circuit design due to transistor density, especially on highly integrated systems, such as multi-processor systems-on-chip (MPSoCs). Therefore,temperature-aware design is mandatory and should be performed at the early design stages. In this paper we present a novel hardware infrastructure to provide thermal control of MPSoC architectures, which is based on exploiting the NoC interconnects of the baseline system as an active component to communicate and coordinate between temperature sensors scattered around the chip, in order to globally monitor the actual temperature. Then, a thermal management unit and clock frequency controllers adjust the frequency and voltage of the processing elements according to the temperature requirements at run-time. We show experimental results of the infrastructure to implement effective global temperature control policies for a real-life 4-core MPSoC, emulated on an FPGA-based emulation framework.
  • Keywords
    integrated circuit design; logic design; multiprocessing systems; multiprocessor interconnection networks; network-on-chip; temperature control; thermal management (packaging); thermal stresses; FPGA-based emulation framework; NoC interconnect; clock frequency controllers; digital circuit design; effective global temperature control; multicore system; multiprocessor system; networks-on-chip; real-life 4-core MPSoC architectures; temperature sensors; temperature stress; temperature-aware design; thermal control; thermal management unit; Control systems; Digital circuits; Frequency; Hardware; Integrated circuit technology; Multicore processing; Temperature control; Temperature sensors; Thermal management; Thermal stresses; DVFS; MPSoC; NoC; Thermal-awareness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI, 2009. ISVLSI '09. IEEE Computer Society Annual Symposium on
  • Conference_Location
    Tampa, FL
  • Print_ISBN
    978-1-4244-4408-3
  • Electronic_ISBN
    978-0-7695-3684-2
  • Type

    conf

  • DOI
    10.1109/ISVLSI.2009.25
  • Filename
    5076405