Vertical optical power delivery and inter-chip interconnect concept based on surface-normal MQW modulators

Author

Tian Gu ; Venkataraman, Anupama P. ; Haney, Michael W.

Author_Institution

Dept. of Electr. & Comput. Eng., Univ. of Delaware, Newark, DE, USA

fYear

2013

fDate

8-12 Sept. 2013

Firstpage

36

Lastpage

37

Abstract

A Chip-level EAM/MQW-based optical interconnect concept with vertically-coupled efficient CW VCSELs and inter-chip links is analyzed, enabled by a lithographically-defined high-density multi-mode waveguide fabric. Projected energy/bit, bandwidth density, and packaging tolerances enable scaling with foreseeable CMOS technology.

Keywords

CMOS integrated circuits; electro-optical modulation; electroabsorption; integrated optics; integrated optoelectronics; laser cavity resonators; optical interconnections; optical waveguides; semiconductor quantum wells; surface emitting lasers; CMOS technology; bandwidth density; chip-level EAM/MQW-based optical interconnect; complementary metal-oxide-semiconductor technology; continuous wave vertical; electroabsorption modulators; interchip interconnect concept; lithographically-defined high-density multimode waveguide fabric; multiple quantum well; packaging tolerances; vertical cavity surface emitting laser; vertical optical power delivery; vertically-coupled efficient CW VCSEL; Couplers; Fabrics; Modulation; Optical interconnections; Optical waveguides; Quantum well devices; Vertical cavity surface emitting lasers; Optical Interconnects; Photonic Integrated Circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Photonics Conference (IPC), 2013 IEEE

Conference_Location

Bellevue, WA

Print_ISBN

978-1-4577-1506-8

Type

conf

DOI

10.1109/IPCon.2013.6656354

Filename

6656354