DocumentCode :
2110693
Title :
Analysis Of Mechanical Stress Associated With Trench Isolation Using A Two-dimensional Simulation
Author :
Matsuda, S. ; Itoh, N. ; Yoshino, C. ; Tsuboi, Y. ; Katsumata, Y. ; Iwat, H.
Author_Institution :
Toshiba Corporation
fYear :
1993
fDate :
14-15 May 1993
Firstpage :
64
Lastpage :
65
Keywords :
Analytical models; Electric variables; Laboratories; Leakage current; Silicon; Spectroscopy; Stress measurement; Temperature; Thermal stresses; Ultra large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Process and Device Modeling, 1993. (1993 VPAD) 1993 International Workshop on
Print_ISBN :
0-7803-1338-0
Type :
conf
DOI :
10.1109/VPAD.1993.724724
Filename :
724724
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2110693
