Design of power converters on 3D-MIDs for driving three-dimensional LED-lamps

The technology of 3D-Molded Interconnect Devices (3D-MID) is investigated as an alternative to circuit board technologies for the realization of novel 3D LED-lighting systems with integrated power electronics. Design constraints for the realization of power electronics on 3D-MID are derived for systems up to 20W power. Limitations are caused by the single layer 3D-MID layout and its low copper thickness, because they directly influence the thermal management, the ampacity and hence the circuit routing of the LED-driver. A prototype system of an automotive day-time running light has been built and tested to prove the realization of LED-lighting systems on 3D-MIDs. The prototype uses an optimized power-sharing technique with reduced wiring effort and contains an adapted thermal management required for its realization on a single, 10μm thin copper layer.