• DocumentCode
    2112251
  • Title

    The Analysis and Establish of Thermal Stress Field Model of the Filmed Tubular Electrothermal Component

  • Author

    Zhang, R.Y. ; Shi, Z.M. ; Zhang, X.M. ; Li, Q.

  • Author_Institution
    Sch. of Mater. Sci. & Eng., Inner Mongolia Univ. of Technol., Huhhot, China
  • fYear
    2010
  • fDate
    28-31 March 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The tubular electrothermal component will produce thermal stress when water in the tube is heated by electricity, which is one of important factors to induce fracture. In this paper, the temperature field and thermal stress field models were established when the inflow and outflow achieved heat balance. According to this model, the distribution of thermal stress and temperature along diameter for the tube sprayed film under operation were analyzed. The results show that thermal stress is related to the material and thickness of the tube, as well as to the power generated by the film. The outer and inner surfaces produce greater thermal stress than elsewhere and therefore fracture is more likely to appear there. What´s more, the inner surface produces the greatest thermal stress, thus the greatest probability of cracks.
  • Keywords
    films; semiconductor materials; thermal stresses; filmed tubular electrothermal component; thermal stress distribution; thermal stress field model; tube sprayed film; Electrothermal effects; Materials science and technology; Resistance heating; Semiconductor films; Temperature distribution; Thermal engineering; Thermal factors; Thermal spraying; Thermal stresses; Water heating;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power and Energy Engineering Conference (APPEEC), 2010 Asia-Pacific
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-4812-8
  • Electronic_ISBN
    978-1-4244-4813-5
  • Type

    conf

  • DOI
    10.1109/APPEEC.2010.5449193
  • Filename
    5449193