DocumentCode
2112251
Title
The Analysis and Establish of Thermal Stress Field Model of the Filmed Tubular Electrothermal Component
Author
Zhang, R.Y. ; Shi, Z.M. ; Zhang, X.M. ; Li, Q.
Author_Institution
Sch. of Mater. Sci. & Eng., Inner Mongolia Univ. of Technol., Huhhot, China
fYear
2010
fDate
28-31 March 2010
Firstpage
1
Lastpage
4
Abstract
The tubular electrothermal component will produce thermal stress when water in the tube is heated by electricity, which is one of important factors to induce fracture. In this paper, the temperature field and thermal stress field models were established when the inflow and outflow achieved heat balance. According to this model, the distribution of thermal stress and temperature along diameter for the tube sprayed film under operation were analyzed. The results show that thermal stress is related to the material and thickness of the tube, as well as to the power generated by the film. The outer and inner surfaces produce greater thermal stress than elsewhere and therefore fracture is more likely to appear there. What´s more, the inner surface produces the greatest thermal stress, thus the greatest probability of cracks.
Keywords
films; semiconductor materials; thermal stresses; filmed tubular electrothermal component; thermal stress distribution; thermal stress field model; tube sprayed film; Electrothermal effects; Materials science and technology; Resistance heating; Semiconductor films; Temperature distribution; Thermal engineering; Thermal factors; Thermal spraying; Thermal stresses; Water heating;
fLanguage
English
Publisher
ieee
Conference_Titel
Power and Energy Engineering Conference (APPEEC), 2010 Asia-Pacific
Conference_Location
Chengdu
Print_ISBN
978-1-4244-4812-8
Electronic_ISBN
978-1-4244-4813-5
Type
conf
DOI
10.1109/APPEEC.2010.5449193
Filename
5449193
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