• DocumentCode
    2112376
  • Title

    Electro-thermal modeling for junction temperature cycling-based lifetime prediction of a press-pack IGBT 3L-NPC-VSC applied to large wind turbines

  • Author

    Senturk, Osman S. ; Munk-Nielsen, Stig ; Teodorescu, Remus ; Helle, Lars ; Rodriguez, Pedro

  • Author_Institution
    Dept. of Energy Technol., Aalborg Univ., Aalborg, Denmark
  • fYear
    2011
  • fDate
    17-22 Sept. 2011
  • Firstpage
    568
  • Lastpage
    575
  • Abstract
    Reliability is a critical criterion for multi-MW wind turbines, which are being employed with increasing numbers in wind power plants, since they operate under harsh conditions and have high maintenance cost due to their remote locations. In this study, the wind turbine grid-side converter reliability is investigated regarding IGBT lifetime based on junction temperature cycling for the grid-side press-pack IGBT 3L-NPC-VSC, which is a state-of-the art high reliability solution. In order to acquire IGBT junction temperatures for given wind power profiles and to use them in IGBT lifetime prediction, the converter electro-thermal model including electrical, power loss, and dynamical thermal models is developed with the main focus on the thermal modeling regarding converter topology, switch technology, and physical structure. Moreover, these models are simplified for their practical implementation in computation platforms. Finally, the converter lifetimes for wind power profiles are predicted using the IGBT lifetime model available. Hence, the developed electro-thermal model´s suitability for the lifetime predictions is shown.
  • Keywords
    insulated gate bipolar transistors; power convertors; power semiconductor devices; semiconductor device packaging; semiconductor device reliability; thermal management (packaging); wind power plants; IGBT lifetime; converter topology; electrothermal modeling; junction temperature cycling; large wind turbines; lifetime prediction; physical structure; press pack IGBT 3L-NPC-VSC; voltage source converter; Cooling; Insulated gate bipolar transistors; Junctions; Switches; Thermal resistance; Wind turbines; Electro-thermal model; lifetime; neutral-point-clamped; press-pack IGBT; reliability; thermal model; three-level; voltage source converter; wind turbine;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2011 IEEE
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    978-1-4577-0542-7
  • Type

    conf

  • DOI
    10.1109/ECCE.2011.6063820
  • Filename
    6063820