DocumentCode
2112476
Title
Optimization of multi-layer metal neural probe design
Author
Tooker, Angela ; Tolosa, Vanessa ; Shah, Kedar G. ; Sheth, H. ; Felix, Sarah ; Delima, T. ; Pannu, Satinderpall
Author_Institution
Lawrence Livermore Nat. Lab., Lawrence, CA, USA
fYear
2012
fDate
Aug. 28 2012-Sept. 1 2012
Firstpage
5995
Lastpage
5998
Abstract
We present here a microfabrication process for multi-layer metal, multi-site, polymer-based neural probes. The process has been used to generate 1-, 2-, and 4-layer trace metal neural probes with highly uniform and reproducible electrode characteristics. Typically, increasing the number of metal layers is assumed to both reduce the width of the neural probes and minimize the injury and glial scarring caused at the implantation site. We show, however, that increasing the number of trace metal layers does not always result in the minimal probe cross-sectional area. A thorough design analysis reveals that the electrode size, along with other design parameters, have interacting effects on the probe cross-sectional area. Moreover, increasing the trace metal layers in the neural probes also increases the design and fabrication cost/time, as well as the likelihood of probe failure. Consequently, all of these factors must be considered when designing a multi-site, neural probe with the objective of minimizing tissue damage.
Keywords
biomedical electrodes; biomedical measurement; microfabrication; neurophysiology; optimisation; 1-layer trace metal neural probe; 2-layer trace metal neural probe; 4-layer trace metal neural probe; electrode size; glial scarring; injury; microfabrication process; multilayer metal neural probe design; multisite neural probe; optimization; polymer-based neural probe; reproducible electrode characteristics; tissue damage; Electrodes; Fabrication; Injuries; Metals; Plastics; Polyimides; Probes; Biocompatible Materials; Equipment Design; Metals; Neurons;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
Conference_Location
San Diego, CA
ISSN
1557-170X
Print_ISBN
978-1-4244-4119-8
Electronic_ISBN
1557-170X
Type
conf
DOI
10.1109/EMBC.2012.6347360
Filename
6347360
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