• DocumentCode
    2112493
  • Title

    Polymer neural interface with dual-sided electrodes for neural stimulation and recording

  • Author

    Tooker, Angela ; Tolosa, Vanessa ; Shah, Kedar G. ; Sheth, H. ; Felix, Sarah ; Delima, T. ; Pannu, Satinderpall

  • Author_Institution
    Lawrence Livermore Nat. Lab., Livermore, CA, USA
  • fYear
    2012
  • fDate
    Aug. 28 2012-Sept. 1 2012
  • Firstpage
    5999
  • Lastpage
    6002
  • Abstract
    We present here a demonstration of a dual-sided, 4-layer metal, polyimide-based electrode array suitable for neural stimulation and recording. The fabrication process outlined here utilizes simple polymer and metal deposition and etching steps, with no potentially harmful backside etches or long exposures to extremely toxic chemicals. These polyimide-based electrode arrays have been tested to ensure they are fully biocompatible and suitable for long-term implantation; their flexibility minimizes the injury and glial scarring that can occur at the implantation site. The creation of dual-side electrode arrays with more than two layers of trace metal enables the fabrication of neural probes with more electrodes without a significant increase in probe size. This allows for more stimulation/recording sites without inducing additional injury and glial scarring.
  • Keywords
    bioMEMS; biomedical electrodes; biomedical materials; etching; microelectrodes; microfabrication; neurophysiology; polymers; biocompatible electrode arrays; dual sided electrodes; dual sided four layer metal; long term implantation; metal deposition; metal etching; neural probe fabrication; neural recording; neural stimulation; polyimide based electrode arrays; polymer deposition; polymer etching; polymer neural interface; Electrodes; Fabrication; Metals; Polyimides; Probes; Silicon; Electrochemical Techniques; Equipment Design; Microelectrodes; Neurons;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
  • Conference_Location
    San Diego, CA
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-4119-8
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2012.6347361
  • Filename
    6347361