DocumentCode :
2112548
Title :
Stretchable biocompatible electronics by embedding electrical circuitry in biocompatible elastomers
Author :
Jahanshahi, A. ; Salvo, Pietro ; Vanfleteren, Jan
Author_Institution :
Centre for Microsyst. Technol. (CMST), IMEC-Ghent Univ., Ghent, Belgium
fYear :
2012
fDate :
Aug. 28 2012-Sept. 1 2012
Firstpage :
6007
Lastpage :
6010
Abstract :
Stretchable and curvilinear electronics has been used recently for the fabrication of micro systems interacting with the human body. The applications range from different kinds of implantable sensors inside the body to conformable electrodes and artificial skins. One of the key parameters in biocompatible stretchable electronics is the fabrication of reliable electrical interconnects. Although very recent literature has reported on the reliability of stretchable interconnects by cyclic loading, work still needs to be done on the integration of electrical circuitry composed of rigid components and stretchable interconnects in a biological environment. In this work, the feasibility of a developed technology to fabricate simple electrical circuits with meander shaped stretchable interconnects is presented. Stretchable interconnects are 200nm thin Au layer supported with polyimide (PI). A stretchable array of light emitting diodes (LEDs) is embedded in biocompatible elastomer using this technology platform and it features a 50% total elongation.
Keywords :
biomedical equipment; biomedical materials; elastomers; integrated circuit interconnections; light emitting diodes; biocompatible elastomer; electrical circuitry; electrical interconnects; elongation; gold layer; light emitting diode; polyimide; skin; stretchable biocompatible electronics; stretchable interconnect; Arrays; Fabrication; Gold; Integrated circuit interconnections; Light emitting diodes; Reliability; Sensors; Biocompatible Materials; Electronics; Microscopy; Microscopy, Electron, Scanning;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
Conference_Location :
San Diego, CA
ISSN :
1557-170X
Print_ISBN :
978-1-4244-4119-8
Electronic_ISBN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2012.6347363
Filename :
6347363
Link To Document :
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