DocumentCode
2113175
Title
A robust wheelchair pressure relief monitoring system
Author
Rui Dai ; Sonenblum, S.E. ; Sprigle, S.
Author_Institution
Rehabilitation Eng. & Appl. Res. Lab. (REAR Lab.), Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2012
fDate
Aug. 28 2012-Sept. 1 2012
Firstpage
6107
Lastpage
6110
Abstract
It is essential to prevent pressure ulcers for people with spinal cord injuries (SCI). Pressure ulcer is likely to develop when there is excessive pressure on the body tissue for lengthy durations. Therefore, persons with SCI, who usually spend long time sitting in wheelchairs, are advised to perform regular pressure reliefs in their daily lives. This paper proposes a system for the monitoring of wheelchair users´ pressure relief behaviors. The system utilizes piezo resistive sensors beneath a wheelchair cushion to monitor pressure, and employs supervised learning techniques to classify a wheelchair user´s pressure relief status. Key features of the system include robustness and not interfering with cushion performance or the daily activities of wheelchair users. The system works well on different types of cushions, and achieves 91% sensitivity and 89% specificity based on tests on different wheelchair users.
Keywords
biological tissues; biomedical equipment; cellular biophysics; injuries; learning (artificial intelligence); medical control systems; neurophysiology; piezoresistive devices; robust control; statistical analysis; wheelchairs; body tissue; cushion performance; piezoresistive sensors; pressure ulcers; robust wheelchair pressure relief monitoring system; robustness; spinal cord injuries; supervised learning techniques; wheelchair cushion; wheelchair users pressure relief behaviors; Monitoring; Pressure measurement; Protocols; Robustness; Sensors; Training; Wheelchairs; Biosensing Techniques; Humans; Monitoring, Physiologic; Pressure Ulcer; Wheelchairs;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
Conference_Location
San Diego, CA
ISSN
1557-170X
Print_ISBN
978-1-4244-4119-8
Electronic_ISBN
1557-170X
Type
conf
DOI
10.1109/EMBC.2012.6347387
Filename
6347387
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