Title :
An Efficient Method for Assessing Board Level Reliability for Micro-electronic Packages using Combined Experimental - Numerical Techniques
Author :
Jansen, M.Y. ; de Vries, J.W.C. ; van Driel, W.D.
Author_Institution :
Philips Appl. Technol., Eindhoven
Abstract :
A new method was developed for modeling electronic packages. The method is applied to a BGA 256 on board. The simulation results were compared to measured results of a thermal cycle test and a thermal shock test. The methodology has shown to be accurate and efficient. This work also shows that thermal transient behavior must be considered in situations where high gradients can occur, like thermal shock tests
Keywords :
ball grid arrays; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; BGA 256; ball grid array; board level reliability assessment; microelectronic packages; thermal cycle test; thermal shock test; thermal transient behavior; Electric shock; Electronic packaging thermal management; Geometry; Parametric statistics; Predictive models; Semiconductor device packaging; Semiconductor device testing; Shape measurement; Soldering; Temperature;
Conference_Titel :
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on
Conference_Location :
Como
Print_ISBN :
1-4244-0275-1
DOI :
10.1109/ESIME.2006.1643982
