From Power SO to E-Pad packages: a thermal bargain?

Author

Villa, Claudio M. ; Morelli, Arianna ; Gualandris, Donata

Author_Institution

ST Microelectron., Milano

fYear

2006

fDate

24-26 April 2006

Firstpage

1

Lastpage

6

Abstract

Facing the demand of low cost solutions for medium power applications from various segments of the electronics market, a full thermal study comparing existing power SMD package families and new e-pad structures is performed. Different body sizes and pin counts are considered. The study consists of thermal modeling analysis carried on using FLOTHERMreg. Thermal simulation results with different PCB configurations are presented. The thermal dissipation mechanism for those packages through the metal bottom case to the PCB is described. The copper exposed area dimension soldered onto the PCB is identified as the dominating factor controlling the total package thermal resistance. Consequently the limits of applicability of new small body e-pad packages versus the old style power SMD´s are finally defined

Keywords

printed circuit manufacture; surface mount technology; thermal management (packaging); thermal resistance; FLOTHERM; PCB configurations; SMD package; e-pad packages; package thermal resistance; power SO; thermal dissipation mechanism; thermal modeling analysis; thermal simulation; Consumer electronics; Copper; Cost function; Electronic packaging thermal management; Immune system; Lead; Microelectronics; Plastic packaging; Power dissipation; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on

Conference_Location

Como

Print_ISBN

1-4244-0275-1

Type

conf

DOI

10.1109/ESIME.2006.1643996

Filename

1643996