Title :
Multiphysics Softwares Benchmark on Ansys / Comsol Applied For RF MEMS Switches Packaging Simulations
Author :
Peyrou, D. ; Pons, P. ; Granier, H. ; Leray, D. ; Ferrand, A. ; Yacine, K. ; Saadaoui, M. ; Nicolas, A. ; Tao, J.W. ; Plana, R.
Author_Institution :
LAAS-CNRS, Toulouse
Abstract :
This paper presents a study on multiphysics software reliability provided by COMSOL and ANSYS. The goal is to give an overview about the fundamentals of how to set up RF simulations, mechanical contact and residual stress through three examples chosen as the main key points in order to make in the future a highly coupled model of the RF MEMS switches packaging
Keywords :
internal stresses; mechanical contact; microswitches; packaging; software reliability; ANSYS; COMSOL; RF MEMS switches; mechanical contact; multiphysics software benchmark; multiphysics software reliability; packaging simulation; radiofrequency simulation; residual stress; Electromagnetic coupling; Packaging; RF signals; Radio frequency; Radiofrequency microelectromechanical systems; Residual stresses; Software packages; Solid modeling; Switches; Thermal stresses;
Conference_Titel :
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on
Conference_Location :
Como
Print_ISBN :
1-4244-0275-1
DOI :
10.1109/ESIME.2006.1644011
