Numerical Identification of Geometric Parameters from Dynamic Measurement of Grinded Membranes on Wafer Level

Author

Ebert, Matthias ; Gerbach, Ronny ; Bagdahn, Jörg ; Michael, Steffen ; Hering, Siegfried

Author_Institution

Fraunhofer Inst. for Mech. of Mater., Halle

fYear

2006

fDate

24-26 April 2006

Firstpage

1

Lastpage

6

Abstract

In the paper a new nondestructive quality testing methods for MEMS were presented that can be applied on wafer level in early stage of the manufacturing process. The approach was applied to determine the thickness of KOH etched membranes from measured eigenfrequencies. The dynamic measurements of test specimen were performed by laser Doppler vibrometry. A finite element (FE) model was created to identify the membrane thickness from the measured eigenfrequency values. A good agreement between the measured thicknesses and the calculated thicknesses of membranes was found. Furthermore, a stochastic model was created to describe the influence of different parameters on the calculated thickness of membrane

Keywords

dynamic testing; eigenvalues and eigenfunctions; finite element analysis; measurement by laser beam; micromechanical devices; nondestructive testing; stochastic processes; vibration measurement; MEMS; dynamic measurement; finite element model; geometric parameters; grinded membranes; laser Doppler vibrometry; nondestructive quality testing; stochastic model; Biomembranes; Etching; Finite element methods; Laser modes; Manufacturing processes; Micromechanical devices; Nondestructive testing; Performance evaluation; Semiconductor device modeling; Thickness measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on

Conference_Location

Como

Print_ISBN

1-4244-0275-1

Type

conf

DOI

10.1109/ESIME.2006.1644016

Filename

1644016