DocumentCode :
2115747
Title :
Lead-Free Solder Cyclic Plasticity Characterization for Drop Test Simulations
Author :
Bonnaud, E.L. ; Gudmundson, P.
Author_Institution :
Infineon Technol. Sweden AB, Stockholm
fYear :
2006
fDate :
24-26 April 2006
Firstpage :
1
Lastpage :
4
Abstract :
Mechanical behaviour of lead-free solder has been investigated experimentally and thereafter modelled analytically. Material test specimens subjected to uniaxial cyclic loadings at different strain rates exhibit noticeable properties: viscoplasticity, nonlinear mixed hardening within each cycle and hardening followed by softening between consecutive cycles. To accurately describe these behaviours, a modified Armstrong and Fredrick model was combined to the Perzyna viscoplastic evolution equation. The set of parameters was determined by both curve-fitting and use of analytical relations
Keywords :
impact testing; solders; viscoplasticity; work hardening; Perzyna viscoplastic evolution equation; cyclic plasticity characterization; drop test simulation; lead-free solder; nonlinear mixed hardening; strain rates; uniaxial cyclic loadings; viscoplasticity; Capacitive sensors; Curve fitting; Electronic equipment testing; Environmentally friendly manufacturing techniques; Lead; Materials reliability; Materials testing; Microstructure; Stress; Uniaxial strain;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on
Conference_Location :
Como
Print_ISBN :
1-4244-0275-1
Type :
conf
DOI :
10.1109/ESIME.2006.1644023
Filename :
1644023
Link To Document :
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