Title :
Fatigue and Thermal Fatigue Damage Analysis of Thin Metal Films
Author :
Zhang, G.P. ; Volkert, C.A. ; Schwaiger, R. ; Mönig, R. ; Kraft, O.
Author_Institution :
Inst. of Metal Res., Chinese Acad. of Sci., Shenyang
Abstract :
In this paper, we summarize several testing methods that are currently available for the characterization of fatigue properties of thin metal films. Using these testing methods, a number of experimental investigations of the fatigue and thermal fatigue of metal films with thicknesses ranging from micrometers to sub-micrometers are described. Extensive experimental observations as well as theoretical analyses reveal that the damage behavior, i.e. typical fatigue extrusions and cracking, are quite different from that of bulk materials, and are controlled by the length scales of the materials. Due to the high surface to volume ratio of thin films interface-induced and diffusion-related damage are prevalent in these small length scale materials. As a result, interfaces pose a serious threat to the reliability of thin films
Keywords :
metallic thin films; micromechanical devices; micrometry; reliability; thermal stress cracking; damage behavior; fatigue properties; interfaces pose; micrometers; thermal fatigue damage analysis; thin film reliability; thin metal films; typical fatigue cracking; typical fatigue extrusions; Electromagnetic measurements; Fabrication; Fatigue; Materials science and technology; Materials testing; Piezoelectric films; Substrates; Temperature; Thermal expansion; Transistors;
Conference_Titel :
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on
Conference_Location :
Como
Print_ISBN :
1-4244-0275-1
DOI :
10.1109/ESIME.2006.1644037