DocumentCode
2116208
Title
Design consideration of 0.4V-operation SOTB MOSFET for super low power application
Author
Makiyama, H. ; Horita, K. ; Iwamatsu, T. ; Oda, H. ; Sugii, N. ; Inoue, Y. ; Yamamoto, Y.
Author_Institution
Low-Power Electron. Assoc. & Project (LEAP), Tsukuba, Japan
fYear
2011
fDate
19-20 May 2011
Firstpage
42
Lastpage
43
Abstract
The silicon on thin buried oxide (SOTB) CMOS is suited for ultralow-voltage operation of CMOS circuits, that is required for drastic power reduction of LSIs because of its small variability and adaptive back bias controllability. In this study, we show that the design concept of threshold voltage for ultralow-voltage (Vdd=0.4V) operation of SOTB. To achieve a good trade-off of Ion and Ioff, gate work function (ΦWF) should be controlled at 4.25-4.35eV and 4.90-5.05eV for N- and P-type MOS-FETs (NMOS and PMOS), respectively. Moreover, higher Nsub is preferable for increasing Ion. Our optimized design achieved that Ion values 170 and 89 μA/μm at Ioff values of 5.6 and 7.8 pA/μm for NMOS and PMOS, respectively. This result indicates that the 0.4-v operation is possible without paying significant speed penalty from the conventional 1-V operation.
Keywords
CMOS integrated circuits; MOSFET; elemental semiconductors; large scale integration; low-power electronics; silicon; LSI; N-type MOSFET; P-type MOSFET; SOTB CMOS circuit; Si; electron volt energy 4.25 eV to 4.35 eV; electron volt energy 4.90 eV to 5.05 eV; power reduction; silicon on thin buried oxide CMOS circuit; super low power application; ultralow-voltage operation; voltage 0.4 V; voltage 1 V; CMOS integrated circuits; Logic gates; MOS devices; Power MOSFET; Threshold voltage; Transistors; SOI; Ultra-low power;
fLanguage
English
Publisher
ieee
Conference_Titel
Future of Electron Devices, Kansai, (IMFEDK), 2011 International Meeting for
Conference_Location
Osaka
Print_ISBN
978-1-61284-145-8
Electronic_ISBN
978-1-61284-147-2
Type
conf
DOI
10.1109/IMFEDK.2011.5944835
Filename
5944835
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