DocumentCode :
2116347
Title :
High-performance capacitive microaccelerometer using large proof-mass and high-amplitude sense voltage
Author :
Yoo, Minwook ; Han, Ki-Ho
Author_Institution :
Sch. of Nano Eng., Inje Univ., Gimhae, South Korea
fYear :
2010
fDate :
1-4 Nov. 2010
Firstpage :
1787
Lastpage :
1790
Abstract :
We present a high-performance surface micromachined capacitive accelerometer, in which the mechanical noise was reduced by a large proof-mass (83.12 μg) and the electrical noise was decreased by a high-amplitude sense voltage (up to 12 Vpp). The proof-mass was increased by using a fabrication process involving anodic bonding of silicon and glass wafers, and by using a non-porous structure of the proof mass. In addition, by using a metal layer patterned on the glass substrate, the notch effect caused by deep RIE process was eliminated. Thereby the weight of the proof-mass could be further increased. The nonlinearity problem, caused by the high-amplitude sense voltage, was avoided using breached finger sensing electrodes. Experimental results showed that the total noise floor and the nonlinearity of the present microaccelerometer are 21.87 μG√Jm and 0.01534%, respectively.
Keywords :
accelerometers; capacitive sensors; micromachining; wafer bonding; anodic bonding; breached finger sensing electrodes; capacitive microaccelerometer; fabrication process; high-amplitude sense voltage; micromachining; non-porous structure; proof-mass;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Sensors, 2010 IEEE
Conference_Location :
Kona, HI
ISSN :
1930-0395
Print_ISBN :
978-1-4244-8170-5
Electronic_ISBN :
1930-0395
Type :
conf
DOI :
10.1109/ICSENS.2010.5689977
Filename :
5689977
Link To Document :
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