The Role of Simulation in Failure Prediction and Design Optimization in Electronics Packaging

Author

Tay, Andrew A O

Author_Institution

Dept. of Mech. Eng., National Univ. of Singapore

fYear

2006

fDate

24-26 April 2006

Firstpage

1

Lastpage

8

Abstract

This paper discusses the role of computer simulation in predicting failure and in optimizing design in electronics packaging. The role played by simulation in predicting failure is illustrated by the use of the fracture mechanics approach in predicting delamination in plastic IC packages undergoing solder reflow. The role played by simulation in optimizing design of IC packages is illustrated by a parametric study of the effect of compliance on the reliability of copper column interconnected wafer level packages. Based on this study, a novel interconnect design is proposed where the interconnect compliance varies continuously from a low value at the centre of the chip to a high value at the perimeter of the chip

Keywords

delamination; electronics packaging; failure analysis; plastic packaging; reflow soldering; delamination; electronics packaging; failure prediction; interconnect design; plastic IC packages; solder reflow; wafer level packages; Computational modeling; Computer simulation; Delamination; Design optimization; Electronics packaging; Integrated circuit packaging; Parametric study; Plastic integrated circuit packaging; Predictive models; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on

Conference_Location

Como

Print_ISBN

1-4244-0275-1

Type

conf

DOI

10.1109/ESIME.2006.1644060

Filename

1644060