DocumentCode
2116744
Title
Modelling and Design of Millimetrewave Passive Circuits: from 2 to 3D
Author
Sorrentino, Roberto
Author_Institution
University of Perugia, Italy
Volume
1
fYear
1994
fDate
5-9 Sept. 1994
Firstpage
48
Lastpage
61
Abstract
With the advances of microwave and millimetrewave circuit technology, fullwave electromagnetic approach has become necessary to model a number of phenomena (proximity effects, package interaction, crosstalk, etc.) dependent on complicated 3-D circuit configurations (multilevel circuits, vertical integration, multichip modules, finite metal thickness, etc.). This paper addresses a number of issues and reviews recent advances relevant to the modelling and optimisation of modern microwave circuits.
Keywords
Electromagnetic waveguides; Frequency; Integrated circuit technology; Microwave circuits; Microwave technology; Millimeter wave technology; Packaging; Passive circuits; Printed circuits; Submillimeter wave technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 1994. 24th European
Conference_Location
Cannes, France
Type
conf
DOI
10.1109/EUMA.1994.337197
Filename
4138242
Link To Document