DocumentCode
2116881
Title
Electrothermai Analysis Oflatch-up In An IGT
Author
Brand, H. ; Selberherr, S.
Author_Institution
Technical University of Vienna
fYear
1993
fDate
14-15 May 1993
Firstpage
116
Lastpage
117
Keywords
Conductivity; Cooling; Current density; Electrothermal effects; Equations; Microelectronics; Temperature dependence; Thermal resistance; Thermodynamics; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Process and Device Modeling, 1993. (1993 VPAD) 1993 International Workshop on
Print_ISBN
0-7803-1338-0
Type
conf
DOI
10.1109/VPAD.1993.724747
Filename
724747
Link To Document