DocumentCode :
2116881
Title :
Electrothermai Analysis Oflatch-up In An IGT
Author :
Brand, H. ; Selberherr, S.
Author_Institution :
Technical University of Vienna
fYear :
1993
fDate :
14-15 May 1993
Firstpage :
116
Lastpage :
117
Keywords :
Conductivity; Cooling; Current density; Electrothermal effects; Equations; Microelectronics; Temperature dependence; Thermal resistance; Thermodynamics; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Process and Device Modeling, 1993. (1993 VPAD) 1993 International Workshop on
Print_ISBN :
0-7803-1338-0
Type :
conf
DOI :
10.1109/VPAD.1993.724747
Filename :
724747
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2116881
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