Limits of integrated circuits

There are no technical limits to the successful realization of high power integrated circuits. The move to high power requires that some additional factors be considered. Better packages are required, larger bonding wires are needed, heavier interconnect metal must be used, and large area power transistors are necessary. In addition, the second breakdown or Safe Operating Area limits of the IC power transistors must be watched, the possibilities of high voltage parasitic MOS action requires new layout rules, and finally, the changes in power dissipation on the IC chip during circuit operation should not degrade the overall circuit performance. These problems are not without solutions.