DocumentCode :
2117019
Title :
Loss evaluation of an AC-AC direct converter with a new GaN HEMT SPICE model
Author :
Okamoto, Masayuki ; Toyoda, Genki ; Hiraki, Eiji ; Tanaka, Toshihiko ; Hashizume, Tamotsu ; Kachi, Tetsu
Author_Institution :
Grad. Sch. of Sci. & Eng., Yamaguchi Univ., Ube, Japan
fYear :
2011
fDate :
17-22 Sept. 2011
Firstpage :
1795
Lastpage :
1800
Abstract :
Wide-band-gap semiconductors, such as gallium nitride (GaN) and silicon carbide (SiC), are expected to be used as materials for new switching devices with low loss and high switching speed. The authors have recently developed a GaN-based high-electron-mobility-transistor (HEMT) for application to power electronics. In this paper we present models of a GaN-based transistor and Schottky barrier diode (SBD) for a simulation program with integrated circuit emphasis (SPICE). The results of the SPICE simulation show that the static and dynamic characteristics of GaN-based devices are precisely simulated by the SPICE models. The application of a GaN-based device to a single-phase AC-AC direct converter results in a reduction of power loss of over 30% compared with a silicon-based one.
Keywords :
AC-AC power convertors; III-V semiconductors; SPICE; Schottky diodes; gallium compounds; high electron mobility transistors; power semiconductor switches; semiconductor device models; wide band gap semiconductors; GaN; HEMT SPICE model; SBD; Schottky barrier diode; gallium nitride; high switching speed; high-electron-mobility-transistor; loss evaluation; power electronics; silicon carbide; simulation program with integrated circuit emphasis; single-phase AC-AC direct converter; wide-band-gap semiconductors; Cathodes; Gallium nitride; HEMTs; Logic gates; Substrates; Switches; Zero voltage switching; AC-AC direct converter; HEMT; Loss evaluation; SBD; Spice Model; gallium nitride;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energy Conversion Congress and Exposition (ECCE), 2011 IEEE
Conference_Location :
Phoenix, AZ
Print_ISBN :
978-1-4577-0542-7
Type :
conf
DOI :
10.1109/ECCE.2011.6064002
Filename :
6064002
Link To Document :
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