• DocumentCode
    2117019
  • Title

    Loss evaluation of an AC-AC direct converter with a new GaN HEMT SPICE model

  • Author

    Okamoto, Masayuki ; Toyoda, Genki ; Hiraki, Eiji ; Tanaka, Toshihiko ; Hashizume, Tamotsu ; Kachi, Tetsu

  • Author_Institution
    Grad. Sch. of Sci. & Eng., Yamaguchi Univ., Ube, Japan
  • fYear
    2011
  • fDate
    17-22 Sept. 2011
  • Firstpage
    1795
  • Lastpage
    1800
  • Abstract
    Wide-band-gap semiconductors, such as gallium nitride (GaN) and silicon carbide (SiC), are expected to be used as materials for new switching devices with low loss and high switching speed. The authors have recently developed a GaN-based high-electron-mobility-transistor (HEMT) for application to power electronics. In this paper we present models of a GaN-based transistor and Schottky barrier diode (SBD) for a simulation program with integrated circuit emphasis (SPICE). The results of the SPICE simulation show that the static and dynamic characteristics of GaN-based devices are precisely simulated by the SPICE models. The application of a GaN-based device to a single-phase AC-AC direct converter results in a reduction of power loss of over 30% compared with a silicon-based one.
  • Keywords
    AC-AC power convertors; III-V semiconductors; SPICE; Schottky diodes; gallium compounds; high electron mobility transistors; power semiconductor switches; semiconductor device models; wide band gap semiconductors; GaN; HEMT SPICE model; SBD; Schottky barrier diode; gallium nitride; high switching speed; high-electron-mobility-transistor; loss evaluation; power electronics; silicon carbide; simulation program with integrated circuit emphasis; single-phase AC-AC direct converter; wide-band-gap semiconductors; Cathodes; Gallium nitride; HEMTs; Logic gates; Substrates; Switches; Zero voltage switching; AC-AC direct converter; HEMT; Loss evaluation; SBD; Spice Model; gallium nitride;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2011 IEEE
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    978-1-4577-0542-7
  • Type

    conf

  • DOI
    10.1109/ECCE.2011.6064002
  • Filename
    6064002