• DocumentCode
    2117404
  • Title

    The impingement-dislocation risk of total hip replacement: Effects of cup orientation and patient maneuvers

  • Author

    Ghaffari, Mohsen ; Nickmanesh, R. ; Tamannaee, N. ; Farahmand, Farid

  • Author_Institution
    Robotic Surg. Lab., Tehran Univ. of Med. Sci., Tehran, Iran
  • fYear
    2012
  • fDate
    Aug. 28 2012-Sept. 1 2012
  • Firstpage
    6801
  • Lastpage
    6804
  • Abstract
    Hip dislocation is one of the most frequent complications after total hip arthroplasty. Impingement and dislocation might be caused due to misalignment of the acetabular cup during surgery, or performing dislocation-prone activities afterwards. A finite element model was developed to predict the impingement and dislocation behavior of the prosthetic joint, for different combinations of cup orientation and patient maneuver. Four dislocation-prone activities of daily life and 25 cup orientations were analyzed to determine how close they are to the impingement and subsequent dcislocation events. The angular margin results obtained indicated that the sit-to-stand and standing while bending at the waist are prone to dislocation, in particular when the cup anteversion angle is small.
  • Keywords
    bending; biomechanics; dislocations; finite element analysis; prosthetics; surgery; acetabular cup; cup orientation effects; dislocation-prone activity; finite element model; hip dislocation; impingement-dislocation risk; patient maneuvers; surgery; total hip arthroplasty; total hip replacement; waist bending; Finite element methods; Head; Hip; Joints; Neck; Prosthetics; Stress; Acetabulum; Arthroplasty, Replacement, Hip; Biomechanical Phenomena; Computer Simulation; Dislocations; Finite Element Analysis; Hip Dislocation; Hip Joint; Hip Prosthesis; Humans; Movement; Prosthesis Design; Prosthesis Failure; Range of Motion, Articular;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
  • Conference_Location
    San Diego, CA
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-4119-8
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2012.6347556
  • Filename
    6347556