DocumentCode
2118783
Title
Optical transceiver ICs based on 3D die-stacking of opto-electronic devices
Author
Duan, Pinxiang ; Raz, Oded ; Smalbrugge, B.E. ; van de Plassche, Karel ; Dorren, H.J.S.
Author_Institution
COBRA Res. Sch., Eindhoven Univ. of Technol., Eindhoven, Netherlands
fYear
2013
fDate
8-12 Sept. 2013
Firstpage
515
Lastpage
516
Abstract
Wafer scale fabrication of the 3D stacked transceivers is discussed. Uniform open eye patterns at 10 Gb/s/channel of both 3D stacked transmitter and receiver ICs indicates that the interconnection technology is robust.
Keywords
integrated circuit interconnections; integrated optoelectronics; optical transceivers; three-dimensional integrated circuits; 3D die-stacking; 3D stacked receiver; 3D stacked transceivers; 3D stacked transmitter; interconnection technology; optical transceiver IC; opto-electronic devices; uniform open eye patterns; wafer scale fabrication; Bandwidth; CMOS integrated circuits; Optical transmitters; Receivers; Stacking; Three-dimensional displays; Vertical cavity surface emitting lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Photonics Conference (IPC), 2013 IEEE
Conference_Location
Bellevue, WA
Print_ISBN
978-1-4577-1506-8
Type
conf
DOI
10.1109/IPCon.2013.6656663
Filename
6656663
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