• DocumentCode
    2118827
  • Title

    Micro-power implantable telemetry device for the study of micro-package technology for chronic biomedical micro-systems

  • Author

    Zhang, R. ; Cong, P. ; Kuo, Hung-I ; Ko, Wen H.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Case Western Reserve Univ., Cleveland, OH, USA
  • fYear
    2010
  • fDate
    1-4 Nov. 2010
  • Firstpage
    2468
  • Lastpage
    2471
  • Abstract
    This paper reports the micro-power telemetry unit that can sense pressure, humidity, and bio-potentials, for the study of micro-package techniques for implantable biomedical micro-systems used in research, diagnosis and therapy. The micro-package study is aimed to develop and demonstrate the micro-package technology for micro-implants to have an implant life of 0.2 to 2.0 years. The telemetry device consumes <; 1.0 μA at 3 volts, with a volume <; 0.2 cm3 including lithium rechargeable battery, and has RF links to charge Li battery and to receive external on-off commands. The device output pulse width changes with a capacitive pressure sensor; and the pulse period changes with an external resistor as the humidity sensor or the bio-potential signals in series with the resistor. The first model of telemetry units, packaged with silicon and epoxy only, lasted more than 70 days in 40°C saline solution. The RF recharging and on-off control circuits was tested, and the lifetime of second generation telemetry unit are being evaluated.
  • Keywords
    bioelectric potentials; biomedical telemetry; humidity sensors; patient diagnosis; patient treatment; pressure sensors; prosthetics; resistors; secondary cells; Li; RF links; biopotentials; capacitive pressure sensor; chronic biomedical microsystems; diagnosis; humidity; lithium rechargeable battery; micropackage technology; micropower implantable telemetry device; on-off control circuits; pressure; resistor; temperature 40 degC; therapy; Capacitive sensor; MEMS; Micro-packaging; Non hermetic; Telemetry circuit;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2010 IEEE
  • Conference_Location
    Kona, HI
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4244-8170-5
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2010.5690069
  • Filename
    5690069