Title :
Characterization of a high temperature multichip SiC JFET-based module
Author :
Xu, Fan ; Jiang, Dong ; Wang, Jing ; Wang, Fred ; Tolbert, Leon M. ; Han, Timothy J. ; Kim, Sung Joon
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of Tennessee, Knoxville, TN, USA
Abstract :
This paper presents a SiC JFET-based, 200°C, 50 kW three-phase inverter module and evaluates its electrical performance. With 1200 V, 100 A rating of the module, each switching element is composed of four paralleled SiC JFETs with two anti-parallel SiC Shottky Barrier Diodes (SBDs). The substrate layout inside the module is designed to reduce package parasitics. Then, experimental static characteristics of the module are obtained over a wide range of temperature, and low on-state resistance is shown up to 200°C. The dynamic performance of this module is evaluated by double pulse test up to 150°C, under 650 V dc bus voltage and 60 A drain current, with different turn-on and turn-off gate resistances. The current unbalance phenomenon and phase-leg shoot-through problem are analyzed too. The results by simulation and experiments show that the causes of shoot-through are JFET inside parameters, package parasitics, and high temperature. The switching losses of this module at different temperatures are shown at the end.
Keywords :
Schottky barriers; Schottky diodes; high-temperature electronics; invertors; junction gate field effect transistors; multichip modules; power field effect transistors; silicon compounds; wide band gap semiconductors; SiC; antiparallel SiC Shottky barrier diodes; current 100 A; current 60 A; current unbalance phenomenon; high temperature multichip JFET-based module; package parasitic reduction; phase-leg shoot-through problem; power 50 kW; substrate layout; switching element; switching losses; temperature 200 degC; three-phase inverter module; turn-off gate resistances; turn-on gate resistances; voltage 1200 V; voltage 650 V; JFETs; Logic gates; Resistance; Silicon carbide; Switches; Temperature; Transient analysis;
Conference_Titel :
Energy Conversion Congress and Exposition (ECCE), 2011 IEEE
Conference_Location :
Phoenix, AZ
Print_ISBN :
978-1-4577-0542-7
DOI :
10.1109/ECCE.2011.6064088