• DocumentCode
    2119861
  • Title

    Applied Materials´ Product Portfolio and Roadmap

  • Author

    Hunter, Aaron ; Zelenko, Jeremy ; Mani, Rajesh

  • Author_Institution
    Appl. Mater., Sunnyvale
  • fYear
    2007
  • fDate
    2-5 Oct. 2007
  • Firstpage
    13
  • Lastpage
    17
  • Abstract
    Applied materials played a pivotal role in the commercial acceptance of rapid thermal processing (RTP) within the semiconductor industry, largely by solving the problem of precisely measuring and controlling the temperature of silicon. Today, our RTP-based products are used for processes as varied as radical oxidation, gate oxide engineering, metal silicide annealing, and ultra shallow junction annealing spanning the temperature range from 240degC to over 1200degC. The next generation RTP - millisecond annealing - is following the same trends by providing the most production worthy yet technically capable tool in the world.
  • Keywords
    annealing; elemental semiconductors; oxidation; rapid thermal annealing; semiconductor device manufacture; silicon; applied materials; gate oxide engineering; metal silicide annealing; millisecond annealing; oxidation; rapid thermal processing; semiconductor industry; ultrashallow junction annealing; Electronics industry; Oxidation; Portfolios; Rapid thermal annealing; Rapid thermal processing; Semiconductor materials; Silicides; Silicon; Temperature control; Temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Thermal Processing of Semiconductors, 2007. RTP 2007. 15th International Conference on
  • Conference_Location
    Catania, Sicily
  • Print_ISBN
    978-1-4244-1228-0
  • Electronic_ISBN
    978-1-4244-1228-0
  • Type

    conf

  • DOI
    10.1109/RTP.2007.4383813
  • Filename
    4383813