Title :
Building memory and sip cubes based on the stacking of rare dice or packaged die
Author_Institution :
3D Plus
Keywords :
Biographies; Furnaces; Lead; Packaging; Production; Soldering; Space technology; Stacking; Telephony; Temperature;
Conference_Titel :
Aerospace Conference, 2003. Proceedings. 2003 IEEE
Print_ISBN :
0-7803-7651-X
DOI :
10.1109/AERO.2003.1235178
