Title :
An efficient means to meet the challenges of very high density packaging in space applications
Author :
BERTHET, Pierre-Eric ; de Saint Roman, D.
Author_Institution :
3D Plus
Keywords :
Application software; Application specific integrated circuits; CMOS technology; Circuit testing; Costs; Paper technology; Random access memory; Semiconductor device packaging; Space technology; Substrates;
Conference_Titel :
Aerospace Conference, 2003. Proceedings. 2003 IEEE
Print_ISBN :
0-7803-7651-X
DOI :
10.1109/AERO.2003.1235179
