DocumentCode :
2120312
Title :
Control of Source and Drain Extension Phosphorus Profile by Using Carbon Co-Implant
Author :
Li, C.I. ; Liu, Ron ; Chan, M. ; Hsiao, T.F. ; Yang, C.L. ; Tzou, S.F.
Author_Institution :
Div. of Central R&D, United Microelectron. Corp., Tainan
fYear :
2007
fDate :
2-5 Oct. 2007
Firstpage :
127
Lastpage :
130
Abstract :
Carbon and fluorine co-implantation have shown encouraging junction formation improvement, especially for P-type junctions. Nevertheless, no obvious improvement is found for arsenic implants. In this paper, phosphorous with different co-implants shows that C co-implant can effectively suppress phosphorous diffusion. With C co-implant, the junction depth decreased 42% at low temperature RTP combined with laser annealing. We implemented L18 DOE experiment with germanium, carbon, phosphorous and RTP splits, and the result shows that the dominant factors are phosphorous dosage and RTP temperature. The best Rs*Xj performance can meet 45 nm requirement.
Keywords :
germanium; ion implantation; laser beam annealing; phosphorus; rapid thermal processing; Ge; Ge - Element; L18 DOE experiment; P; P - Element; carbon co-implantation; drain extension; fluorine co-implantation; germanium; junction formation; laser annealing; p-type junctions; phosphorous; phosphorus profile; rapid thermal processing; source extension; Annealing; Atomic layer deposition; Atomic measurements; Centralized control; Electrical resistance measurement; Implants; Microelectronics; Solids; Temperature; US Department of Energy; Carbon; LSA; Phosphorous; co-implantation; ultra shallow junction;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Thermal Processing of Semiconductors, 2007. RTP 2007. 15th International Conference on
Conference_Location :
Catania, Sicily
Print_ISBN :
978-1-4244-1227-3
Electronic_ISBN :
978-1-4244-1228-0
Type :
conf
DOI :
10.1109/RTP.2007.4383831
Filename :
4383831
Link To Document :
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